US Patent Issued to Applied Materials on June 2 for "Tunable hardware to control radial flow distribution in a processing chamber" (California Inventors)

ALEXANDRIA, Va., June 2 -- United States Patent no. 12,644,184, issued on June 2, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Tunable hardware to control radial flow distribution in a processing chamber" was invented by Sanjeev Baluja (Campbell, Calif.) and Muhannad Mustafa (Milpitas, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Gas distribution assemblies comprising a backing plate, a first enclosure with an outer diameter smaller than an outer diameter of an opening in the center of the backing plate. A top plate is connected to the top of the first enclosure. A compressible seal surrounds the first enclosure connecting the top plate to the backing plate outside the opening in t...