ALEXANDRIA, Va., June 9 -- United States Patent no. 12,650,453, issued on June 9, was assigned to International Business Machines Corp. (Armonk, N.Y.). "EMC scattering apparatus" was invented by John... Read More
ALEXANDRIA, Va., June 9 -- United States Patent no. 12,650,454, issued on June 9, was assigned to GE VERNOVA INFRASTRUCTURE TECHNOLOGY LLC (Greenville, S.C.). "Systems and methods for determining a d... Read More
ALEXANDRIA, Va., June 9 -- United States Patent no. 12,650,455, issued on June 9, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan). "Semiconductor device and overcurrent protection device" wa... Read More
ALEXANDRIA, Va., June 9 -- United States Patent no. 12,650,456, issued on June 9, was assigned to Nexperia B.V. (Nijmegen, Netherlands). "Method of testing a semiconductor device as well as a corresp... Read More
ALEXANDRIA, Va., June 9 -- United States Patent no. 12,650,457, issued on June 9, was assigned to Canon K.K. (Tokyo). "Semiconductor apparatus, image capturing apparatus, image capturing system, and ... Read More
ALEXANDRIA, Va., June 9 -- United States Patent no. 12,650,458, issued on June 9, was assigned to Onto Innovation SDI LLC (Tampa, Fla.). "Wide bandgap semiconductor characterization based on capacita... Read More
ALEXANDRIA, Va., June 9 -- United States Patent no. 12,650,459, issued on June 9, was assigned to Intel Corp. (Santa Clara, Calif.). "Test and repair of interconnects between chips" was invented by S... Read More
ALEXANDRIA, Va., June 9 -- United States Patent no. 12,650,460, issued on June 9, was assigned to TEXAS INSTRUMENTS Inc. (Dallas). "Calibration for routing resistance induced error" was invented by G... Read More
ALEXANDRIA, Va., June 9 -- United States Patent no. 12,650,461, issued on June 9, was assigned to Ohio State Innovation Foundation (Columbus, Ohio). "Use of electromagnetic signature to determine the... Read More
ALEXANDRIA, Va., June 9 -- United States Patent no. 12,650,462, issued on June 9, was assigned to AEM SINGAPORE PTE. LTD. (Singapore). "Device and thermal tester for thermal testing dies of an integr... Read More