ALEXANDRIA, Va., June 9 -- United States Patent no. 12,650,462, issued on June 9, was assigned to AEM SINGAPORE PTE. LTD. (Singapore).

"Device and thermal tester for thermal testing dies of an integrated circuit" was invented by See Jean Chan (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "A device for thermal testing one or more exposed or covered dies of an integrated circuit and a thermal tester for testing one or more exposed or covered dies of an integrated circuit on a testing platform are provided. The device for thermal testing the one or more exposed or covered dies of the integrated circuit includes a pedestal and a heatlet attached to a first end of the pedestal. The heatlet includes a f...