US Patent Issued to Intel on June 9 for "Test and repair of interconnects between chips" (Indian, Israeli, American Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,650,459, issued on June 9, was assigned to Intel Corp. (Santa Clara, Calif.).

"Test and repair of interconnects between chips" was invented by Sreejit Chakravarty (San Jose, Calif.), Adithya Kashyap (Mysuru, India), Vijaya Chelli (Daggubadu, India), Micha Shahar (Petah Tikva, Israel), Rakesh Kandula (Bangalore, India) and Dovev Amosi (Natanya, Israel).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments herein relate to a test, repair, and diagnostic solution for chip-to-chip interconnects. In one aspect, on a first chip, a first finite state machine (FSM) is coupled to a set of transmit lanes. To test each transmit lane, one at a time, the first FS...