US Patent Issued to Nexperia on June 9 for "Method of testing a semiconductor device as well as a corresponding testing device" (German Inventor)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,650,456, issued on June 9, was assigned to Nexperia B.V. (Nijmegen, Netherlands).

"Method of testing a semiconductor device as well as a corresponding testing device" was invented by Magnus Siegfried Rummey (Hamburg, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of testing a semiconductor device, in a package, having a junction between a semiconductor material of a first type and a semiconductor material of a second type. The junction has a temperature dependent breakdown voltage, and the method includes the steps of determining the breakdown voltage, providing a fixed voltage over the junction, via pins of the package, and the fixed vo...