US Patent Issued to DENSO, TOYOTA JIDOSHA, MIRISE Technologies on April 21 for "Method of manufacturing nitride semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,756, issued on April 21, was assigned to DENSO Corp. (Kariya-city, Japan), TOYOTA JIDOSHA K.K. (Toyota, Japan) and MIRISE Technologies Corp... Read More

US Patent Issued to Hitachi High-Tech on April 21 for "Film formation method and plasma processing method" (Japanese Inventor)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,757, issued on April 21, was assigned to Hitachi High-Tech Corp. (Tokyo). "Film formation method and plasma processing method" was invente... Read More

US Patent Issued to Applied Materials, Regents of the University of California on April 21 for "Dielectric on dielectric selective deposition using aniline passivation" (California Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,758, issued on April 21, was assigned to Applied Materials Inc. (Santa Clara, Calif.) and Regents of the University of California (Oakland,... Read More

US Patent Issued to ASM IP Holding on April 21 for "Topology-selective nitride deposition method and structure formed using same" (Belgian Inventor)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,759, issued on April 21, was assigned to ASM IP Holding B.V. (Almere, Netherlands). "Topology-selective nitride deposition method and stru... Read More

US Patent Issued to SONY SEMICONDUCTOR SOLUTIONS on April 21 for "Semiconductor chip and manufacturing method therefor" (Japanese Inventor)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,760, issued on April 21, was assigned to SONY SEMICONDUCTOR SOLUTIONS Corp. (Kanagawa, Japan). "Semiconductor chip and manufacturing metho... Read More

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on April 21 for "Metal etching with reduced tilt angle" (Taiwanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,761, issued on April 21, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Metal etching with reduced ti... Read More

US Patent Issued to The Board of Trustees of the University of Illinois on April 21 for "Large area synthesis of cubic phase gallium nitride on silicon" (Illinois Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,762, issued on April 21, was assigned to The Board of Trustees of the University of Illinois (Urbana, Ill.). "Large area synthesis of cubi... Read More

US Patent Issued to Tokyo Electron on April 21 for "Semiconductor devices and methods of manufacturing the same" (New York Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,763, issued on April 21, was assigned to Tokyo Electron Ltd. (Tokyo). "Semiconductor devices and methods of manufacturing the same" was in... Read More

US Patent Issued to Virginia Tech Intellectual Properties on April 21 for "Termination structures for semiconductor devices" (Virginia Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,764, issued on April 21, was assigned to Virginia Tech Intellectual Properties Inc. (Blacksburg, Va.). "Termination structures for semicon... Read More

US Patent Issued to NANYA TECHNOLOGY on April 21 for "Manufacturing method of semiconductor device" (Taiwanese Inventor)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,765, issued on April 21, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Manufacturing method of semiconductor device" ... Read More

• ««
• «
• 28830
• 28831
• 28832
• 28833
• 28834
• 28835
• 28836
• 28837
• 28838
• 28839
• »
• »»