US Patent Issued to SK hynix on April 7 for "Electronic device having stacked structures and method for manufacturing the same" (South Korean Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,754, issued on April 7, was assigned to SK hynix Inc. (Gyeonggi-do, South Korea). "Electronic device having stacked structures and method f... Read More

US Patent Issued to Zhuhai Chuangfeixin Technology on April 7 for "Memory storage device and method of manufacturing the same" (California Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,755, issued on April 7, was assigned to Zhuhai Chuangfeixin Technology Co. Ltd. (Zhuhai, China). "Memory storage device and method of manuf... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on April 7 for "Phase change material (PCM) switch having low heater resistance" (Taiwanese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,756, issued on April 7, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Phase change material (PCM) switch ... Read More

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on April 7 for "Structure and formation method of package with hybrid interconnection" (Taiwanese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,757, issued on April 7, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Structure and formation method ... Read More

US Patent Issued to SAMSUNG ELECTRONICS on April 7 for "Semiconductor device including dummy pad" (South Korean Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,758, issued on April 7, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor device including dummy pad" wa... Read More

US Patent Issued to International Business Machines on April 7 for "High-density metal-insulator-metal capacitor integration wth nanosheet stack technology" (New York Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,759, issued on April 7, was assigned to International Business Machines Corp. (Armonk, N.Y.). "High-density metal-insulator-metal capacitor... Read More

US Patent Issued to SAMSUNG ELECTRONICS on April 7 for "Semiconductor device and method of fabricating the same" (South Korean Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,760, issued on April 7, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor device and method of fabricati... Read More

US Patent Issued to Infineon Technologies Austria on April 7 for "Diode including a trench electrode subdivided into at least first and second parts" (German Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,761, issued on April 7, was assigned to Infineon Technologies Austria AG (Villach, Austria). "Diode including a trench electrode subdivided... Read More

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on April 7 for "Methods of manufacturing a semiconductor device with local isolation and a semiconductor device with local isolation" (Taiwanese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,762, issued on April 7, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Methods of manufacturing a semi... Read More

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on April 7 for "Semiconductor device structure with metal gate stack" (Taiwanese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,763, issued on April 7, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Semiconductor device structure ... Read More

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