US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on April 7 for "Structure and formation method of package with hybrid interconnection" (Taiwanese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,757, issued on April 7, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Structure and formation method of package with hybrid interconnection" was invented by Tsung-Fu Tsai (Changhua County, Taiwan), Szu-Wei Lu (Hsinchu City, Taiwan), Shih-Peng Tai (Xinpu Township, Taiwan) and Chen-Hua Yu (Hsinchu City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure and a formation method are provided. The method includes providing a semiconductor substrate and bonding a first chip structure on the semiconductor substrate through metal-to-metal bonding and dielectric-to-dielectric bonding. The method als...