US Patent Issued to SAMSUNG ELECTRONICS on April 7 for "Semiconductor device and method of fabricating the same" (South Korean Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,760, issued on April 7, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor device and method of fabricating the same" was invented by Jungmin Park (Suwon-si, South Korea), Hanjin Lim (Suwon-si, South Korea) and Hyungsuk Jung (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device comprising a substrate, lower electrodes vertically extended on the substrate and horizontally spaced apart from each other, a conductive pattern provided on the substrate to conformally cover the lower electrodes, supporting patterns provided to penetrate the conductive pattern and connected to portions...