US Patent Issued to TEXAS INSTRUMENTS on June 16 for "Apparatus including an isolation assembly" (Indian Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,633, issued on June 16, was assigned to TEXAS INSTRUMENTS Inc. (Dallas). "Apparatus including an isolation assembly" was invented by Sreera... Read More

US Patent Issued to Chipletz on June 16 for "Semiconductor package with integrated capacitors" (Texas Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,634, issued on June 16, was assigned to Chipletz Inc. (Spicewood, Texas). "Semiconductor package with integrated capacitors" was invented b... Read More

US Patent Issued to GlobalFoundries U.S. on June 16 for "Machine-readable code in integrated circuit" (Vermont Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,635, issued on June 16, was assigned to GlobalFoundries U.S. Inc. (Malta, N.Y.). "Machine-readable code in integrated circuit" was invented... Read More

US Patent Issued to QING DING PRECISION ELECTRONICS (HUAIAN), Avary Holding (Shenzhen), GARUDA TECHNOLOGY on June 16 for "Packaging structure, packaging substrate, and manufacturing method of the packaging structure" (Chinese Inventor)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,636, issued on June 16, was assigned to QING DING PRECISION ELECTRONICS (HUAIAN) Co. LTD (Huai an, China), Avary Holding (Shenzhen) Co. Ltd.... Read More

US Patent Issued to Phoenix Pioneer Technology on June 16 for "Package carrier board integrated with inductive circuit structure and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,637, issued on June 16, was assigned to Phoenix Pioneer Technology Co. Ltd. (Hsinchu County, Taiwan). "Package carrier board integrated wit... Read More

US Patent Issued to Deca Technologies USA on June 16 for "Layered molded direct contact and dielectric structure and method for making the same" (California, Washington, Minnesota, Arizona Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,638, issued on June 16, was assigned to Deca Technologies USA Inc. (Tempe, Ariz.). "Layered molded direct contact and dielectric structure ... Read More

US Patent Issued to TEXAS INSTRUMENTS on June 16 for "Quad flat no-lead (QFN) manufacturing process" (Malaysian Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,639, issued on June 16, was assigned to TEXAS INSTRUMENTS Inc. (Dallas). "Quad flat no-lead (QFN) manufacturing process" was invented by Ho... Read More

US Patent Issued to TEXAS INSTRUMENTS on June 16 for "Semiconductor device package for press fit assembly" (American, Japanese Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,640, issued on June 16, was assigned to TEXAS INSTRUMENTS Inc. (Dallas). "Semiconductor device package for press fit assembly" was invented... Read More

US Patent Issued to Amkor Technology Singapore Holding on June 16 for "Semiconductor devices having wettable flanks and methods of manufacturing semiconductor devices" (South Korean Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,641, issued on June 16, was assigned to Amkor Technology Singapore Holding Pte. Ltd. (Singapore). "Semiconductor devices having wettable fl... Read More

US Patent Issued to Mitsubishi Electric on June 16 for "Semiconductor device" (Japanese Inventor)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,642, issued on June 16, was assigned to Mitsubishi Electric Corp. (Tokyo). "Semiconductor device" was invented by Hiroyuki Masumoto (Tokyo)... Read More

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