US Patent Issued to QING DING PRECISION ELECTRONICS (HUAIAN), Avary Holding (Shenzhen), GARUDA TECHNOLOGY on June 16 for "Packaging structure, packaging substrate, and manufacturing method of the packaging structure" (Chinese Inventor)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,636, issued on June 16, was assigned to QING DING PRECISION ELECTRONICS (HUAIAN) Co. LTD (Huai an, China), Avary Holding (Shenzhen) Co. Ltd. (Shenzhen, China) and GARUDA TECHNOLOGY Co. LTD. (New Taipei, Taiwan).

"Packaging structure, packaging substrate, and manufacturing method of the packaging structure" was invented by Zhi-Cheng Lan (Shenzhen, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A packaging substrate includes a circuit board defining a through groove. The circuit board includes an insulating body and a first wiring layer formed on the insulating body. A colloid is formed in the through groove. The packaging substrate further incl...