US Patent Issued to Phoenix Pioneer Technology on June 16 for "Package carrier board integrated with inductive circuit structure and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,637, issued on June 16, was assigned to Phoenix Pioneer Technology Co. Ltd. (Hsinchu County, Taiwan).

"Package carrier board integrated with inductive circuit structure and manufacturing method thereof" was invented by Che-Wei Hsu (Hsinchu County, Taiwan), Pao-Hung Chou (Hsinchu County, Taiwan) and Shih-Ping Hsu (Hsinchu County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package carrier board includes a first circuit build-up structure, a patterned magnetic conductive metal layer, a plurality of first conductive pillar, a second insulating layer, and a second circuit build-up structure. The patterned magnetic conductive metal layer is d...