US Patent Issued to TEXAS INSTRUMENTS on June 16 for "Semiconductor device package for press fit assembly" (American, Japanese Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,640, issued on June 16, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).

"Semiconductor device package for press fit assembly" was invented by Kwang-Soo Kim (Sunnyvale, Calif.), Makoto Shibuya (Tokyo) and Woochan Kim (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes: a package substrate having a device mount surface and on an opposite bottom side surface; at least one semiconductor die mounted on the device mount surface; and leads having a base portion attached to the device mount surface and having an internal portion extending away from a first bend at a first angle, the internal portion of the leads...