US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on May 12 for "SRAM device for FPGA application" (Taiwanese Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,327, issued on May 12, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "SRAM device for FPGA application"... Read More

US Patent Issued to YANGTZE MEMORY TECHNOLOGIES on May 12 for "Memory devices having vertical transistors and methods for forming the same" (Chinese Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,328, issued on May 12, was assigned to YANGTZE MEMORY TECHNOLOGIES Co. LTD. (Wuhan, China). "Memory devices having vertical transistors and ... Read More

US Patent Issued to Kioxia on May 12 for "Semiconductor memory device" (Japanese Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,329, issued on May 12, was assigned to Kioxia Corp. (Tokyo). "Semiconductor memory device" was invented by Naomi Ito (Shinagawa, Japan) and ... Read More

US Patent Issued to SAMSUNG ELECTRONICS on May 12 for "Semiconductor device" (South Korean Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,330, issued on May 12, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor device" was invented by Junhyeok... Read More

US Patent Issued to SAMSUNG ELECTRONICS on May 12 for "Semiconductor memory device having stacked word lines including sub-gate electrodes" (South Korean Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,331, issued on May 12, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor memory device having stacked wor... Read More

US Patent Issued to Kioxia on May 12 for "Memory device and method of manufacturing memory device" (Japanese Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,332, issued on May 12, was assigned to Kioxia Corp. (Tokyo). "Memory device and method of manufacturing memory device" was invented by Mutsu... Read More

US Patent Issued to SAMSUNG ELECTRONICS on May 12 for "Semiconductor device including a seperation layer" (South Korean Inventor)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,333, issued on May 12, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor device including a seperation la... Read More

US Patent Issued to SAMSUNG ELECTRONICS on May 12 for "Semiconductor devices" (South Korean Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,334, issued on May 12, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Semiconductor devices" was invented by Daej... Read More

US Patent Issued to Applied Materials on May 12 for "Support layer for small pitch fill" (California Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,335, issued on May 12, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Support layer for small pitch fill" was invented by Fr... Read More

US Patent Issued to SAMSUNG ELECTRONICS on May 12 for "Semiconductor devices" (South Korean Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,336, issued on May 12, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor devices" was invented by Dongoh ... Read More

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