US Patent Issued to Massachusetts Institute of Technology on June 16 for "Multi-regional epitaxial growth and related systems and articles" (Massachusetts Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,519, issued on June 16, was assigned to Massachusetts Institute of Technology (Cambridge, Mass.). "Multi-regional epitaxial growth and rela... Read More

US Patent Issued to SHIN-ETSU CHEMICAL on June 16 for "Method for producing laminate, producing apparatus for laminate, laminate, and semiconductor device" (Japanese Inventor)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,520, issued on June 16, was assigned to SHIN-ETSU CHEMICAL Co. LTD. (Tokyo). "Method for producing laminate, producing apparatus for lamina... Read More

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING, NATIONAL YANG MING CHIAO TUNG UNIVERSITY on June 16 for "Semiconductor structure and manufacturing method thereof" (Taiwanese, American Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,521, issued on June 16, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan) and NATIONAL YANG MING CHIAO TUNG ... Read More

US Patent Issued to Applied Materials on June 16 for "Anisotropic epitaxial growth of silicon germanium" (California Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,522, issued on June 16, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Anisotropic epitaxial growth of silicon germanium" w... Read More

US Patent Issued to Kioxia on June 16 for "Method for manufacturing semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,523, issued on June 16, was assigned to Kioxia Corp. (Tokyo). "Method for manufacturing semiconductor device" was invented by Yuta Saito (Y... Read More

US Patent Issued to KOKUSAI ELECTRIC on June 16 for "Method of manufacturing semiconductor device, method of processing substrate, recording medium, and substrate processing apparatus" (Japanese Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,524, issued on June 16, was assigned to KOKUSAI ELECTRIC Corp. (Tokyo). "Method of manufacturing semiconductor device, method of processing... Read More

US Patent Issued to Tokyo Electron on June 16 for "Apparatus and methods for processing bonding semiconductor wafers" (New York Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,525, issued on June 16, was assigned to Tokyo Electron Ltd. (Tokyo). "Apparatus and methods for processing bonding semiconductor wafers" wa... Read More

US Patent Issued to BRILLIAN NETWORK & AUTOMATION INTEGRATED SYSTEM on June 16 for "Gas curtain device and gas permeable assembly with baffle plate" (Taiwanese Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,526, issued on June 16, was assigned to BRILLIAN NETWORK & AUTOMATION INTEGRATED SYSTEM Co. LTD. (Miaoli County, Taiwan). "Gas curtain devi... Read More

US Patent Issued to Hitachi High-Tech on June 16 for "Film formation method and plasma processing method" (Japanese Inventor)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,527, issued on June 16, was assigned to Hitachi High-Tech Corp. (Tokyo). "Film formation method and plasma processing method" was invented ... Read More

US Patent Issued to Fabric8Labs on June 16 for "Methods for fabricating protected electrode arrays with initial interposer bonding" (California Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,528, issued on June 16, was assigned to Fabric8Labs Inc. (San Diego). "Methods for fabricating protected electrode arrays with initial inte... Read More

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