US Patent Issued to KOKUSAI ELECTRIC on June 16 for "Method of manufacturing semiconductor device, method of processing substrate, recording medium, and substrate processing apparatus" (Japanese Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,524, issued on June 16, was assigned to KOKUSAI ELECTRIC Corp. (Tokyo).

"Method of manufacturing semiconductor device, method of processing substrate, recording medium, and substrate processing apparatus" was invented by Tatsushi Ueda (Toyama, Japan), Masanori Nakayama (Toyama, Japan), Katsunori Funaki (Toyama, Japan), Yasutoshi Tsubota (Toyama, Japan), Hiroto Igawa (Toyama, Japan), Yuki Yamakado (Toyama, Japan), Hiroki Kishimoto (Toyama, Japan), Yuichiro Takeshima (Toyama, Japan) and Keita Ichimura (Toyama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing a semiconductor device includes: (a) generating a reactive speci...