ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,521, issued on June 16, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan) and NATIONAL YANG MING CHIAO TUNG UNIVERSITY (Hsinchu City, Taiwan).
"Semiconductor structure and manufacturing method thereof" was invented by Chun-Liang Lin (Hsinchu City, Taiwan), Chenming Hu (Oakland, Calif.), Wan-Hsin Chen (Hsinchu City, Taiwan) and Naoya Kawakami (Hsinchu City, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure in various embodiments provides a method. In some embodiments of the present disclosure, the method includes forming a transition metal dichalcogenide layer on a substrate; and performing a...