ALEXANDRIA, Va., March 3 -- United States Patent no. 12,567,236, issued on March 3, was assigned to LG CNS Co. LTD. (Seoul, South Korea). "Continuous use authentication method, device, and recording ... Read More
ALEXANDRIA, Va., March 3 -- United States Patent no. D1,115,825, issued on March 3, was assigned to ASICS Corp. (Kobe, Japan). "Display screen or portion thereof with transitional graphical user inte... Read More
ALEXANDRIA, Va., March 3 -- United States Patent no. D1,116,254, issued on March 3, was assigned to Dongguan WIMI Times Technology Co. Ltd. (Dongguan, China). "Hair dryer" was invented by Shantan Hu ... Read More
ALEXANDRIA, Va., March 3 -- United States Patent no. 12,565,148, issued on March 3, was assigned to FUYAO GLASS AMERICA INC. (Moraine, Ohio). "Structurally-reinforced volumetric bracket for mounting ... Read More
ALEXANDRIA, Va., March 3 -- United States Patent no. 12,567,622, issued on March 3, was assigned to MICROVAST POWER SYSTEMS Co. LTD. (Huzhou, China) and MICROVAST INC. (Stafford, Texas). "Energy stor... Read More
ALEXANDRIA, Va., March 3 -- United States Patent no. 12,565,960, issued on March 3. "Pipe valve insulation cover" was invented by Dominic J. Maida Jr. (Newark, Del.). According to the abstract* rele... Read More
ALEXANDRIA, Va., March 3 -- United States Patent no. 12,568,220, issued on March 3, was assigned to GENSQUARE LLC (Seoul, South Korea). "Method of removing deblocking artifacts" was invented by Min J... Read More
ALEXANDRIA, Va., March 3 -- United States Patent no. 12,568,362, issued on March 3, was assigned to ARKRAY Inc. (Kyoto, Japan). "Measurement device, measurement system, measurement method, and measur... Read More
ALEXANDRIA, Va., March 3 -- United States Patent no. 12,568,865, issued on March 3, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Semiconductor package" was invented by Ge... Read More
ALEXANDRIA, Va., March 3 -- United States Patent no. 12,568,864, issued on March 3. "Stacked package structure including a chip disposed on a redistribution layer and a molding layer comprises a rece... Read More