US Patent Issued on March 3 for "Stacked package structure including a chip disposed on a redistribution layer and a molding layer comprises a recess" (Taiwanese Inventors)

ALEXANDRIA, Va., March 3 -- United States Patent no. 12,568,864, issued on March 3.

"Stacked package structure including a chip disposed on a redistribution layer and a molding layer comprises a recess" was invented by Pei-chun Tsai (Hsinchu County, Taiwan), Hung-hsin Hsu (Hsinchu County, Taiwan), Shang-yu Chang Chien (Hsinchu County, Taiwan) and Chia-ling Lee (Hsinchu County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A stacked package structure and a manufacturing method thereof are provided. The stacked package structure includes an upper redistribution layer, a first chip, and an upper molding layer. The first chip is disposed on the upper redistribution layer and is electrically connected to ...