US Patent Issued to SAMSUNG ELECTRONICS on March 3 for "Semiconductor package" (South Korean Inventor)

ALEXANDRIA, Va., March 3 -- United States Patent no. 12,568,865, issued on March 3, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).

"Semiconductor package" was invented by Geunwoo Kim (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package may include a substrate including a connection circuit, a redistribution structure, and a chip structure on the redistribution structure. The redistribution structure may include a rear redistribution layer electrically connected to the connection circuit, a first semiconductor chip between rear and front redistribution portions and electrically connection to a front redistribution layer of the front redistribu...