US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on April 21 for "Semiconductor device package structure and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,834, issued on April 21, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Semiconductor device package ... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on April 21 for "Interposer substrate, package structure and manufacturing method of package structure" (Taiwanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,835, issued on April 21, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Interposer substrate, package str... Read More

US Patent Issued to ROHM on April 21 for "Semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,836, issued on April 21, was assigned to ROHM Co. LTD. (Kyoto, Japan). "Semiconductor device" was invented by Yusuke Harada (Kyoto, Japan)... Read More

US Patent Issued to LUXSHARE ELECTRONIC TECHNOLOGY (KUNSHAN) on April 21 for "Laterally mounted and packaged structure and manufacturing method thereof" (Chinese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,837, issued on April 21, was assigned to LUXSHARE ELECTRONIC TECHNOLOGY (KUNSHAN) LTD. (Kunshan City, China). "Laterally mounted and packa... Read More

US Patent Issued to PHOENIX PIONEER TECHNOLOGY on April 21 for "Component-embedded packaging structure" (Taiwanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,838, issued on April 21, was assigned to PHOENIX PIONEER TECHNOLOGY Co. LTD. (Hsinchu County, Taiwan). "Component-embedded packaging struc... Read More

US Patent Issued to Micron Technology on April 21 for "Packaged microelectronic devices having stacked interconnect elements and methods for manufacturing the same" (California, Idaho Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,839, issued on April 21, was assigned to Micron Technology Inc. (Boise, Idaho). "Packaged microelectronic devices having stacked interconn... Read More

US Patent Issued to PANASONIC INTELLECTUAL PROPERTY MANAGEMENT on April 21 for "Method for manufacturing semiconductor device including forming opening in resist of the semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,840, issued on April 21, was assigned to PANASONIC INTELLECTUAL PROPERTY MANAGEMENT Co. LTD. (Osaka, Japan). "Method for manufacturing sem... Read More

US Patent Issued to PROTEC on April 21 for "Method of bonding column type deposits" (South Korean Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,841, issued on April 21, was assigned to PROTEC Co. LTD. (Gyeonggi-do, South Korea). "Method of bonding column type deposits" was invented... Read More

US Patent Issued to Innolux on April 21 for "Electronic device including an underfill layer and a protective structure adjacent to the underfill layer" (Taiwanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,842, issued on April 21, was assigned to Innolux Corp. (Miao-Li County, Taiwan). "Electronic device including an underfill layer and a pro... Read More

US Patent Issued to NANYA TECHNOLOGY on April 21 for "Semiconductor structure having dummy conductive member and manufacturing method thereof" (Taiwanese Inventor)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,843, issued on April 21, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Semiconductor structure having dummy conductiv... Read More

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