US Patent Issued to Micron Technology on April 21 for "Packaged microelectronic devices having stacked interconnect elements and methods for manufacturing the same" (California, Idaho Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,839, issued on April 21, was assigned to Micron Technology Inc. (Boise, Idaho).

"Packaged microelectronic devices having stacked interconnect elements and methods for manufacturing the same" was invented by Young Do Kweon (Boise, Idaho) and Tongbi Jiang (Santa Clara, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Microelectronic devices and method of forming a plurality of microelectronic devices on a semiconductor workpiece are disclosed herein. One such method includes placing a plurality of first interconnect elements on a side of a semiconductor workpiece, forming a layer on the side of the workpiece, reshaping the first interconnect ele...