ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,836, issued on April 21, was assigned to ROHM Co. LTD. (Kyoto, Japan).
"Semiconductor device" was invented by Yusuke Harada (Kyoto, Japan) and Hiroyuki Shinkai (Kyoto, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes an electrically insulating substrate including a substrate main surface and a substrate back surface facing opposite to each other in a thickness direction and at least one substrate side surface facing a direction intersecting the thickness direction, a semiconductor element arranged at a side of the substrate main surface, a heat-dissipating conductive portion that is provided at a position overlap...