US Patent Issued to Murata Manufacturing on July 14 for "Backside deep trench capacitor and inductor structures" (California, Texas Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,149, issued on July 14, was assigned to Murata Manufacturing Co. Ltd. (Kyoto, Japan). "Backside deep trench capacitor and inductor structur... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on July 14 for "Extended via connect for pixel array" (Taiwanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,150, issued on July 14, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Extended via connect for pixel arra... Read More

US Patent Issued to Huawei Technologies on July 14 for "Semiconductor device and manufacturing method therefor" (Chinese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,151, issued on July 14, was assigned to Huawei Technologies Co. LTD. (Shenzhen, China). "Semiconductor device and manufacturing method ther... Read More

US Patent Issued to Super Micro Computer on July 14 for "Mesh inductors and antennas of electronic assemblies" (American, Taiwanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,152, issued on July 14, was assigned to Super Micro Computer Inc. (San Jose, Calif.). "Mesh inductors and antennas of electronic assemblies... Read More

US Patent Issued to International Business Machines on July 14 for "Sensor for thermal dissipation measurement" (New York Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,153, issued on July 14, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Sensor for thermal dissipation measurement" ... Read More

US Patent Issued to SAMSUNG ELECTRONICS on July 14 for "Semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,154, issued on July 14, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor package" was invented by Jongg... Read More

US Patent Issued to SILICONWARE PRECISION INDUSTRIES on July 14 for "Electronic package and substrate structure thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,155, issued on July 14, was assigned to SILICONWARE PRECISION INDUSTRIES Co. LTD. (Taichung City, Taiwan). "Electronic package and substrat... Read More

US Patent Issued to Amkor Technology Singapore Holding on July 14 for "Electronic devices and methods of manufacturing electronic devices" (South Korean Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,156, issued on July 14, was assigned to Amkor Technology Singapore Holding Pte. Ltd. (Singapore). "Electronic devices and methods of manufa... Read More

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on July 14 for "Etching-damage-free intermetal dielectric layer with thermal dissipation feature" (Taiwanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,157, issued on July 14, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Etching-damage-free intermetal ... Read More

US Patent Issued to DENKA on July 14 for "Heat dissipation member" (Japanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,158, issued on July 14, was assigned to DENKA COMPANY Ltd. (Tokyo). "Heat dissipation member" was invented by Daisuke Goto (Tokyo) and Hiro... Read More

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