US Patent Issued to Huawei Technologies on July 14 for "Semiconductor device and manufacturing method therefor" (Chinese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,151, issued on July 14, was assigned to Huawei Technologies Co. LTD. (Shenzhen, China).

"Semiconductor device and manufacturing method therefor" was invented by Dong Chen (Shanghai), Jie Sun (Shanghai) and Zhixiong Zeng (Shanghai).

According to the abstract* released by the U.S. Patent & Trademark Office: "The disclosure provides manufacturing methods and semiconductor devices. One example method includes that a semiconductor device includes a substrate and an inductor, where a shield layer is formed between the substrate and the inductor, and the shield layer is used to shield an electrical coupling between the substrate and the inductor."

The patent was filed on April 28, 2022...