US Patent Issued to SAMSUNG ELECTRONICS on July 14 for "Semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,154, issued on July 14, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Semiconductor package" was invented by Jonggyu Lee (Suwon-si, South Korea), Jaechoon Kim (Suwon-si, South Korea), Taehwan Kim (Suwon-si, South Korea) and Hwanjoo Park (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a package substrate, a semiconductor chip on the package substrate and having a first surface facing the package substrate and a second surface, opposite to the first surface, an encapsulant disposed on the package substrate and on a side surface of the semiconductor chip, a heat dissipation...