US Patent Issued to SILICONWARE PRECISION INDUSTRIES on July 14 for "Electronic package and substrate structure thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,155, issued on July 14, was assigned to SILICONWARE PRECISION INDUSTRIES Co. LTD. (Taichung City, Taiwan).

"Electronic package and substrate structure thereof" was invented by Pin-Jing Su (Taichung City, Taiwan), Wen-Yu Teng (Taichung City, Taiwan), Liang-Yi Hung (Taichung City, Taiwan), Chia-Cheng Chen (Taichung City, Taiwan) and Yu-Po Wang (Taichung City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic package and a substrate structure thereof are provided, in which an electronic element and a flow stopper surrounding the electronic element are disposed on a substrate body of the substrate structure, and a heat dissipation stru...