US Patent Issued to International Business Machines on July 14 for "Octagonal interconnect wiring for advanced logic" (New York Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,110, issued on July 14, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Octagonal interconnect wiring for advanced l... Read More

US Patent Issued to International Business Machines on July 14 for "Semiconductor structures including metal wires with edge curvature" (New York Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,111, issued on July 14, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Semiconductor structures including metal wir... Read More

US Patent Issued to Adeia Semiconductor Solutions on July 14 for "Method of forming copper interconnect structure with manganese barrier layer" (New York Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,112, issued on July 14, was assigned to Adeia Semiconductor Solutions LLC (San Jose, Calif.). "Method of forming copper interconnect struct... Read More

US Patent Issued to Fujian Jinhua Integrated Circuit on July 14 for "Contact pad structure and manufacturing method thereof" (Chinese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,114, issued on July 14, was assigned to Fujian Jinhua Integrated Circuit Co. Ltd. (Quanzhou City, China). "Contact pad structure and manufa... Read More

US Patent Issued to Applied Materials on July 14 for "Growth suppression deposition for CVD tungsten gap fill with thermal treatment" (California Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,115, issued on July 14, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Growth suppression deposition for CVD tungsten gap f... Read More

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING CMPANY on July 14 for "Local interconnect" (Taiwanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,116, issued on July 14, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING CMPANY LTD. (Hsinchu, Taiwan). "Local interconnect" was invented... Read More

US Patent Issued to UNITED MICROELECTRONICS on July 14 for "Semiconductor circuit pattern and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,117, issued on July 14, was assigned to UNITED MICROELECTRONICS CORP. (Hsin-Chu City, Taiwan). "Semiconductor circuit pattern and manufactu... Read More

US Patent Issued to ASM IP Holding on July 14 for "Methods and systems for filling a gap" (Finnish, Belgian Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,118, issued on July 14, was assigned to ASM IP Holding B.V. (Almere, Netherlands). "Methods and systems for filling a gap" was invented by ... Read More

US Patent Issued to SAMSUNG ELECTRONICS on July 14 for "Reversed high aspect ratio contact (HARC) structure and process" (New York Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,119, issued on July 14, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Reversed high aspect ratio contact (HARC) st... Read More

US Patent Issued to QUALCOMM on July 14 for "Self-aligned backside contact module for 3DIC application" (California Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,120, issued on July 14, was assigned to QUALCOMM Inc. (San Diego). "Self-aligned backside contact module for 3DIC application" was invented... Read More

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