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US Patent Issued to SCREEN HOLDINGS on May 12 for "Substrate processing method and substrate processing apparatus" (Japanese Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,602, issued on May 12, was assigned to SCREEN HOLDINGS Co. LTD. (Japan). "Substrate processing method and substrate processing apparatus" wa... Read More


US Patent Issued to ASM IP Holding on May 12 for "Sensor array, apparatus for dispensing a vapor phase reactant to a reaction chamber and related methods" (Japanese Inventor)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,603, issued on May 12, was assigned to ASM IP Holding B.V. (Almere, Netherlands). "Sensor array, apparatus for dispensing a vapor phase reac... Read More


US Patent Issued to Applied Materials on May 12 for "Processing methods and cluster tools for forming semiconductor devices" (California, Texas Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,604, issued on May 12, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Processing methods and cluster tools for forming semic... Read More


US Patent Issued to WONIK IPS on May 12 for "Substrate processing apparatus" (South Korean Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,605, issued on May 12, was assigned to WONIK IPS Co. LTD. (Pyeongtaek-si, South Korea). "Substrate processing apparatus" was invented by Seu... Read More


US Patent Issued to Taiwan Semiconductor Manufacturing on May 12 for "Laser beam adjustment in semiconductor device fabrication" (Taiwanese Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,606, issued on May 12, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsin-Chu, Taiwan). "Laser beam adjustment in semiconduct... Read More


US Patent Issued to Ushio Denki on May 12 for "Optical heating device with angled light holding substrate and method of heating treatment thereof" (Japanese Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,607, issued on May 12, was assigned to Ushio Denki K.K. (Tokyo). "Optical heating device with angled light holding substrate and method of h... Read More


US Patent Issued to Kokusai Electric on May 12 for "Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording medium" (Japanese Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,608, issued on May 12, was assigned to Kokusai Electric Corp. (Tokyo). "Substrate processing apparatus, method of manufacturing semiconducto... Read More


US Patent Issued to Applied Materials on May 12 for "In-chamber metrology of substrates for process characterization and improvement" (Indian, American Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,609, issued on May 12, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "In-chamber metrology of substrates for process charact... Read More


US Patent Issued to Taiwan Semiconductor Manufacturing on May 12 for "Integrated semiconductor die vessel processing workstations" (Taiwanese Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,610, issued on May 12, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Integrated semiconductor die vessel p... Read More


US Patent Issued to Tokyo Electron on May 12 for "Substrate transfer apparatus and substrate transfer method" (Japanese Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,611, issued on May 12, was assigned to Tokyo Electron Ltd. (Tokyo). "Substrate transfer apparatus and substrate transfer method" was invente... Read More