ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,602, issued on May 12, was assigned to SCREEN HOLDINGS Co. LTD. (Japan).

"Substrate processing method and substrate processing apparatus" was invented by Zhida Wang (Kyoto, Japan), Koji Ando (Kyoto, Japan), Noritake Sumi (Kyoto, Japan), Chiaki Moriya (Kyoto, Japan) and Daiki Uehara (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "This invention relates to a substrate processing technique for performing a pressure increasing step, a pressure keeping step and a pressure reducing step in this order in a processing container. A flow rate of a processing fluid in a processing space is suppressed to a second flow rate lower than a first flow ra...