US Patent Issued to Kokusai Electric on May 12 for "Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording medium" (Japanese Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,608, issued on May 12, was assigned to Kokusai Electric Corp. (Tokyo).

"Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording medium" was invented by Taku Hisada (Toyama, Japan), Tsukasa Yashima (Toyama, Japan) and Shin Tsujimura (Toyama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "According to the present disclosure, there is provided a technique capable of substantially uniformizing the quality of each substrate by setting the position of the substrate in accordance with the process conditions for each step of the substrate processing. According to one aspect thereof, th...