US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on April 21 for "Metal etching with reduced tilt angle" (Taiwanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,761, issued on April 21, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Metal etching with reduced ti... Read More

US Patent Issued to The Board of Trustees of the University of Illinois on April 21 for "Large area synthesis of cubic phase gallium nitride on silicon" (Illinois Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,762, issued on April 21, was assigned to The Board of Trustees of the University of Illinois (Urbana, Ill.). "Large area synthesis of cubi... Read More

US Patent Issued to Tokyo Electron on April 21 for "Semiconductor devices and methods of manufacturing the same" (New York Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,763, issued on April 21, was assigned to Tokyo Electron Ltd. (Tokyo). "Semiconductor devices and methods of manufacturing the same" was in... Read More

US Patent Issued to Virginia Tech Intellectual Properties on April 21 for "Termination structures for semiconductor devices" (Virginia Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,764, issued on April 21, was assigned to Virginia Tech Intellectual Properties Inc. (Blacksburg, Va.). "Termination structures for semicon... Read More

US Patent Issued to NANYA TECHNOLOGY on April 21 for "Manufacturing method of semiconductor device" (Taiwanese Inventor)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,765, issued on April 21, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Manufacturing method of semiconductor device" ... Read More

US Patent Issued to NANYA TECHNOLOGY on April 21 for "Method of patterning a semiconductor structure" (Taiwanese Inventor)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,766, issued on April 21, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Method of patterning a semiconductor structure... Read More

US Patent Issued to Wolfspeed on April 21 for "Additives for grinding semiconductor workpieces" (North Carolina Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,767, issued on April 21, was assigned to Wolfspeed Inc. (Durham, N.C.). "Additives for grinding semiconductor workpieces" was invented by ... Read More

US Patent Issued to SAMSUNG ELECTRONICS on April 21 for "Method of processing a substrate" (South Korean Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,768, issued on April 21, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Method of processing a substrate" was inve... Read More

US Patent Issued to DISCO on April 21 for "Processing method" (Japanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,769, issued on April 21, was assigned to DISCO Corp. (Tokyo). "Processing method" was invented by Naoko Yamamoto (Tokyo) and Tomoaki Sugiy... Read More

US Patent Issued to SCREEN Holdings on April 21 for "Substrate processing system and substrate processing method" (Japanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,770, issued on April 21, was assigned to SCREEN Holdings Co. Ltd. (Kyoto, Japan). "Substrate processing system and substrate processing me... Read More

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