ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,768, issued on April 21, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Method of processing a substrate" was invented by Junsang Kim (Suwon-si, South Korea), Yunha Kim (Suwon-si, South Korea), Hyeonjun Yun (Suwon-si, South Korea) and Kwanghyun Cho (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method of processing a substrate includes disposing a substrate in a substrate processing apparatus and polishing the substrate. The substrate processing apparatus includes a polishing head and a polishing part. The polishing head includes a polishing head body. The polishing head body includes a pressure memb...