US Patent Issued to POWERTECH TECHNOLOGY on April 7 for "Package device and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,014, issued on April 7, was assigned to POWERTECH TECHNOLOGY INC. (Hsinchu County, Taiwan). "Package device and manufacturing method thereo... और पढ़ें

US Patent Issued to Hyundai Motor, Kia on April 7 for "Power module for vehicle" (South Korean Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,015, issued on April 7, was assigned to Hyundai Motor Co. (Seoul, South Korea) and Kia Corp. (Seoul, South Korea). "Power module for vehicl... और पढ़ें

US Patent Issued to Dell Products on April 7 for "Flip chip package" (Texas Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,016, issued on April 7, was assigned to Dell Products LP (Round Rock, Texas). "Flip chip package" was invented by Qinghong He (Austin, Texa... और पढ़ें

US Patent Issued to LG INNOTEK on April 7 for "Package substrate" (South Korean Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,017, issued on April 7, was assigned to LG INNOTEK Co. LTD. (Seoul, South Korea). "Package substrate" was invented by Nam Heon Kim (Seoul, ... और पढ़ें

US Patent Issued to Taiwan Semiconductor Manufacturing on April 7 for "Package structure with enhancement structure and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,018, issued on April 7, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Package structure with enhancement ... और पढ़ें

US Patent Issued to Zhuhai ACCESS Semiconductor on April 7 for "Embedded packaging structure and manufacturing method thereof" (Chinese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,019, issued on April 7, was assigned to Zhuhai ACCESS Semiconductor Co. Ltd. (Guangdong, China). "Embedded packaging structure and manufact... और पढ़ें

US Patent Issued to Kulicke and Soffa Industries on April 7 for "Electronic component bonding machines, and methods of measuring a distance on such machines" (Pennsylvania Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,020, issued on April 7, was assigned to Kulicke and Soffa Industries Inc. (Fort Washington, Pa.). "Electronic component bonding machines, a... और पढ़ें

US Patent Issued to Altera on April 7 for "Homogenous die stacking with increased element density" (American, Indian Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,021, issued on April 7, was assigned to Altera Corp. (San Jose, Calif.). "Homogenous die stacking with increased element density" was inven... और पढ़ें

US Patent Issued to ASMPT SINGAPORE on April 7 for "Apparatus for applying a sintering force via a compressible film" (Singaporean Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,022, issued on April 7, was assigned to ASMPT SINGAPORE PTE. LTD. (Singapore). "Apparatus for applying a sintering force via a compressible... और पढ़ें

US Patent Issued to WINBOND ELECTRONICS on April 7 for "Semiconductor structure and method for forming the same and semiconductor device" (Taiwanese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,023, issued on April 7, was assigned to WINBOND ELECTRONICS CORP. (Taichung City, Taiwan). "Semiconductor structure and method for forming ... और पढ़ें

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