India, July 1 -- As large AI models and 100,000-card computing clusters rapidly accelerate, industry development has transcended the independent evolution of optics, storage, electricity, and chips. Optical interconnects form the core framework for efficient computing cluster communication.

Integrated circuit manufacturing and advanced packaging lay the process foundation for silicon photonics and co-packaged optics (CPO). High-end memory chips determine the data throughput of computing clusters, while electronic systems and embedded technologies enable the ultimate deployment of computing power.

Against this backdrop, the International Integrated Circuit Innovation Expo (IICIE 2026), the 27th China International Optoelectronic Expo (CI...