India, Sept. 17 -- There was another panel discussion around advanced packaging at the ongoing Semicon India 2026.

The participants were: Tim McIntosh, VP, TSAT Business Head, Tata Electronics, Manish Ranjan, Business Management, HI, Applied Materials, Dr. Akshay Singh, Corporate VP, Micron Technology, and Babu Mandava, President and CEO, 3dGS. Sujay Shetty, Partner, ESDM & Semiconductor, PwC, was the moderator.

Sujay Shetty said can India can now go from assembling chips to architecting them.

Tim McIntosh stated he has been 35+ years in the business. We need to bring advanced packaging to India as fast as possible. Manish Ranjan added this is an exciting time to be in advanced packaging. AI is also leading to packaging constraints. Dr...