ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,959, issued on Oct. 27, was assigned to ETRON TECHNOLOGY INC. (Hsinchu, Taiwan). "3D IC structure" was invented by Chao-Chun Lu (Hsinchu, T... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,960, issued on Oct. 27, was assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES LLC (Scottsdale, Ariz.). "Fan out package for a semiconductor p... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,961, issued on Oct. 27, was assigned to Amkor Technology Singapore Holding Pte. Ltd. (Singapore). "Electronic devices and methods of manufa... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,962, issued on Oct. 27, was assigned to TEXAS INSTRUMENTS Inc. (Dallas). "Shielded lead package for high voltage devices" was invented by M... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,963, issued on Oct. 27, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Semiconductor package with stif... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,964, issued on Oct. 27, was assigned to STMicroelectronics International N.V. (Geneva). "Method for manufacturing several integrated circui... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,965, issued on Oct. 27, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Semiconductor device with slanted conductive lay... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,966, issued on Oct. 27, was assigned to Huawei Technologies'Co.'Ltd.' (Shenzhen, China). "Multi-side power delivery in stacked memory packa... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,967, issued on Oct. 27, was assigned to Adeia Semiconductor Bonding Technologies Inc. (San Jose, Calif.). "Element with routing structure i... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,968, issued on Oct. 27, was assigned to Intel Corp. (Santa Clara, Calif.). "Modular package architecture for voltage regulator-compute-memo... Read More