US Patent Issued to Adeia Semiconductor Bonding Technologies on Oct. 27 for "Element with routing structure in bonding layer" (North Carolina Inventor)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,967, issued on Oct. 27, was assigned to Adeia Semiconductor Bonding Technologies Inc. (San Jose, Calif.).

"Element with routing structure in bonding layer" was invented by Gaius Gillman Fountain Jr. (Youngsville, N.C.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A bonded structure is disclosed. The bonded structure can include a first element that includes a first bonding layer, the first bonding layer that has a first contact pad and a routing trace. The routing trace is formed at the same level as the first contact pad. The bonded structure can include a second element that includes a second bonding layer that has a second contact pad. The first...