US Patent Issued to TEXAS INSTRUMENTS on Oct. 27 for "Shielded lead package for high voltage devices" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,962, issued on Oct. 27, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).

"Shielded lead package for high voltage devices" was invented by Masamitsu Matsuura (Hiji, Japan), Makoto Shibuya (Setagaya-ku, Japan), Daiki Komatsu (Hiji, Japan) and Kengo Aoya (Beppu, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A microelectronic device includes one or more electronic components attached to a package substrate which has an exposed surface to provide an area for mounting a heatsink. The microelectronic device includes one or more leads that are electrically connected to the electronic component. The lead extends away from the exposed surface of the pa...