ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,939, issued on Oct. 27, was assigned to SK hynix Inc. (Gyeonggi-do, South Korea). "Semiconductor device and manufacturing method of semicon... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,940, issued on Oct. 27, was assigned to STATS ChipPAC Pte. Ltd. (Singapore). "Semiconductor device and method of selective shielding using ... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,941, issued on Oct. 27, was assigned to STMICROELECTRONICS INTERNATIONAL N.V. (Geneva). "Wire bond electromagnetic interference (EMI) cage ... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,942, issued on Oct. 27, was assigned to Advanced Micro Devices Inc. (Santa Clara, Calif.). "Chip package with tamper prevention" was invent... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,943, issued on Oct. 27, was assigned to Skyworks Solutions Inc. (Irvine, Calif.). "Multi chip front end module with shielding vias" was inv... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,944, issued on Oct. 27, was assigned to Beijing BOE Technology Development Co. Ltd. (Beijing). "High integration substrate integrated with ... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,945, issued on Oct. 27, was assigned to TEXAS INSTRUMENTS Inc. (Dallas). "Integrated circuit having improved ASML alignment marks" was inve... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,946, issued on Oct. 27, was assigned to SK hynix Inc. (Gyeonggi-do, South Korea). "Semiconductor wafer including alignment key pattern laye... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,947, issued on Oct. 27, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package with stepped redistrib... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,948, issued on Oct. 27, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package and wiring substrate i... Read More