US Patent Issued to STATS ChipPAC on Oct. 27 for "Semiconductor device and method of selective shielding using FOD material" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,940, issued on Oct. 27, was assigned to STATS ChipPAC Pte. Ltd. (Singapore).

"Semiconductor device and method of selective shielding using FOD material" was invented by JiSik Moon (Incheon, South Korea), YoungSang Kim (Gyeonggi-do, South Korea) and JiEun Kwon (Incheon, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device has a substrate and first electrical component disposed over the substrate. A first shielding layer is disposed over the first electrical component. A first film material is disposed between the first electrical component and first shielding layer for selective attachment of the first shielding layer. A ...