US Patent Issued to SK hynix on Oct. 27 for "Semiconductor wafer including alignment key pattern layer including contact pattern layer disposed thereon" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,946, issued on Oct. 27, was assigned to SK hynix Inc. (Gyeonggi-do, South Korea).

"Semiconductor wafer including alignment key pattern layer including contact pattern layer disposed thereon" was invented by Heon Yong Chang (Gyeonggi-do, South Korea) and Hyeong Geun Joe (Gyeonggi-do, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "In an embodiment, a semiconductor wafer includes an alignment key structure disposed over a substrate, a contact pattern layer disposed on the alignment key structure to extend upward of the alignment key structure, and an insulating layer in contact with the alignment key structure and the contact pattern layer ...