US Patent Issued to Advanced Micro Devices on Oct. 27 for "Chip package with tamper prevention" (Texas, California Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,942, issued on Oct. 27, was assigned to Advanced Micro Devices Inc. (Santa Clara, Calif.).

"Chip package with tamper prevention" was invented by Mohit Arora (Austin, Texas), Deepak Vasant Kulkarni (Austin, Texas), Richard E. George (Santa Clara, Calif.) and Terry Eugene Richardson (Austin, Texas).

According to the abstract* released by the U.S. Patent & Trademark Office: "A chip package includes a package substrate and an integrated circuit (IC) die disposed on the package substrate. The IC dies includes a security asset. The chip package also includes a glass based shield selectively disposed on the IC die and above the security asset. The glass based shield is configured to blo...