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US Patent Issued to IDEMITSU KOSAN on May 12 for "Photoelectric conversion element and method for manufacturing photoelectric conversion element" (Japanese Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,460, issued on May 12, was assigned to IDEMITSU KOSAN Co. LTD. (Tokyo). "Photoelectric conversion element and method for manufacturing photo... Read More


US Patent Issued to Azur Space Solar Power on May 12 for "Passivation method for a passage opening of a wafer" (German Inventor)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,461, issued on May 12, was assigned to Azur Space Solar Power GmbH (Heilbronn, Germany). "Passivation method for a passage opening of a wafe... Read More


US Patent Issued to Samsung Electro-Mechanics on May 12 for "Image sensor package" (South Korean Inventor)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,462, issued on May 12, was assigned to Samsung Electro-Mechanics Co. Ltd. (Suwon-si, South Korea). "Image sensor package" was invented by Eu... Read More


US Patent Issued to SAMSUNG ELECTRONICS on May 12 for "Methods and system of enhanced near-infrared light absorption of imaging systems using metasurfaces and nanostructures" (California, Massachusetts Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,463, issued on May 12, was assigned to SAMSUNG ELECTRONICS Co. LTD. (South Korea). "Methods and system of enhanced near-infrared light absor... Read More


US Patent Issued to SHENZHEN ADAPS PHOTONICS TECHNOLOGY on May 12 for "Systems and methods for stacked sensors with electrical insulation" (Chinese, American Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,464, issued on May 12, was assigned to SHENZHEN ADAPS PHOTONICS TECHNOLOGY Co. LTD. (Shenzhen City, China). "Systems and methods for stacked... Read More


US Patent Issued to Magnolia White on May 12 for "Method for manufacturing inorganic light emitter" (Japanese Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,465, issued on May 12, was assigned to Magnolia White Corp. (Tokyo). "Method for manufacturing inorganic light emitter" was invented by Masa... Read More


US Patent Issued to Ingentec on May 12 for "Encapsulation process method for wafer-level light-emitting diode dies" (Taiwanese Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,466, issued on May 12, was assigned to Ingentec Corp. (Miaoli County, Taiwan). "Encapsulation process method for wafer-level light-emitting ... Read More


US Patent Issued to THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS on May 12 for "Heterogeneous chip integration of III-nitride-based materials for optoelectronic device arrays in the visible and ultraviolet" (Illinois, California Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,467, issued on May 12, was assigned to THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS (Urbana, Ill.). "Heterogeneous chip integration o... Read More


US Patent Issued to SAMSUNG ELECTRONICS, SEOUL NATIONAL UNIVERSITY R&DB FOUNDATION on May 12 for "Method of manufacturing micro-light emitting diode and method of manufacturing display apparatus by using the same" (South Korean Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,468, issued on May 12, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea) and SEOUL NATIONAL UNIVERSITY R&DB FOUNDATION (Se... Read More


US Patent Issued to BEIJING BOE TECHNOLOGY DEVELOPMENT, BOE TECHNOLOGY GROUP on May 12 for "Quantum dot light emitting structure, method for manufacturing the same, array substrate, and display device" (Chinese Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,469, issued on May 12, was assigned to BEIJING BOE TECHNOLOGY DEVELOPMENT Co. LTD. (Beijing) and BOE TECHNOLOGY GROUP Co. LTD. (Beijing). "Q... Read More