ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,462, issued on May 12, was assigned to Samsung Electro-Mechanics Co. Ltd. (Suwon-si, South Korea).
"Image sensor package" was invented by Eun Bae Park (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "An image sensor package is provided. The image sensor package includes an image sensor, a substrate on which the image sensor is disposed on a first surface of the substrate and a receiving groove is disposed in a second surface of the surface, and a heat dissipation element including a heat absorption portion configured to absorb heat from a contact surface and a heat emission portion configured to emit heat absorbed by the heat abs...