ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,466, issued on May 12, was assigned to Ingentec Corp. (Miaoli County, Taiwan).
"Encapsulation process method for wafer-level light-emitting diode dies" was invented by Ai-Sen Liu (Miaoli County, Taiwan), Hsiao-Lu Chen (Miaoli County, Taiwan), Yi-Chuan Huang (Miaoli County, Taiwan) and Hsiang-An Feng (Miaoli County, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "An encapsulation process method for wafer-level light-emitting diode dies is provided, in which a wafer structure having a plurality of light-emitting diode dies thereon is adhered to a temporary substrate, and by sequentially performing a laser cutting and a laser punch-through process...