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US Patent Issued to Kobe Steel on Oct. 20 for "Method for manufacturing dissimilar material joint structure, and dissimilar material joint structure" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,766,635, issued on Oct. 20, was assigned to Kobe Steel Ltd. (Kobe, Japan). "Method for manufacturing dissimilar material joint structure, and d... Read More


US Patent Issued to MELEXIS TECHNOLOGIES on Oct. 20 for "Electrical contact between separated semiconductor layers" (Belgian Inventor)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,766,636, issued on Oct. 20, was assigned to MELEXIS TECHNOLOGIES NV (Tessenderlo, Belgium). "Electrical contact between separated semiconductor... Read More


US Patent Issued to SHENZHEN GEESUN INTELLIGENT TECHNOLOGY on Oct. 20 for "Laser cutting method" (Chinese Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,766,637, issued on Oct. 20, was assigned to SHENZHEN GEESUN INTELLIGENT TECHNOLOGY Co. LTD. (Guangdong, China). "Laser cutting method" was inve... Read More


US Patent Issued on Oct. 20 for "Laser cutting system and method to create an adhesive film for a shape" (Arizona Inventor)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,766,638, issued on Oct. 20. "Laser cutting system and method to create an adhesive film for a shape" was invented by Andrew T Garcia (Gilbert, ... Read More


US Patent Issued to DISCO CORPORATIN on Oct. 20 for "Marking machine and wafer production system" (Japanese Inventor)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,766,639, issued on Oct. 20, was assigned to DISCO CORPORATIN (Tokyo). "Marking machine and wafer production system" was invented by Kentaro Iiz... Read More


US Patent Issued to DISCO on Oct. 20 for "Wafer processing method" (Japanese Inventor)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,766,640, issued on Oct. 20, was assigned to DISCO Corp. (Tokyo). "Wafer processing method" was invented by Masaru Nakamura (Tokyo). According ... Read More


US Patent Issued to MITSUBISHI ELECTRIC on Oct. 20 for "Laser processing apparatus and laser processing method" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,766,642, issued on Oct. 20, was assigned to MITSUBISHI ELECTRIC Corp. (Tokyo). "Laser processing apparatus and laser processing method" was inv... Read More


US Patent Issued to Senju Metal Industry on Oct. 20 for "Solder alloy, solder ball, solder paste, and solder joint" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,766,643, issued on Oct. 20, was assigned to Senju Metal Industry Co. Ltd. (Tokyo). "Solder alloy, solder ball, solder paste, and solder joint" ... Read More


US Patent Issued on Oct. 20 for "Floating system and method for a tool" (Michigan Inventor)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,766,645, issued on Oct. 20. "Floating system and method for a tool" was invented by Wylie Chase (Clarkston, Mich.). According to the abstract*... Read More


US Patent Issued to POSCO on Oct. 20 for "Apparatus for preventing welding distortion, and method for welding pipe and flange using the same" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,766,647, issued on Oct. 20, was assigned to POSCO Co. LTD (Pohang-si, South Korea). "Apparatus for preventing welding distortion, and method fo... Read More