US Patent Issued to DISCO on Oct. 20 for "Wafer processing method" (Japanese Inventor)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,766,640, issued on Oct. 20, was assigned to DISCO Corp. (Tokyo).

"Wafer processing method" was invented by Masaru Nakamura (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wafer processing method includes sticking a protective tape to a front surface of a wafer, applying a laser beam to the wafer from a back surface of the wafer to thereby form trial modified layers, dividing the wafer to form a sample piece, bending the sample piece to the protective tape side to expose a section, imaging the section, and measuring the positions of the trial modified layers, thereby generating measurement data. Thereafter, appropriate positions inside the wafer ...