ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,766,643, issued on Oct. 20, was assigned to Senju Metal Industry Co. Ltd. (Tokyo).
"Solder alloy, solder ball, solder paste, and solder joint" was invented by Takahiro Matsufuji (Tokyo), Shunsaku Yoshikawa (Tokyo) and Hiroki Sudo (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "Provided are a solder, a solder alloy, a solder ball, a solder paste, and a solder joint, which have a low melting point, high hardness in a high-temperature environment, heat cycle resistance, and electromigration resistance. The solder alloy has an alloy composition that includes, by mass %, Bi: 30 to 60%, Ag: 0.7 to 2.0%, Cu: more than 0% and 1.00% or less, Ni: 0.01 to 1....