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US Patent Issued to Applied Materials on June 23 for "In-situ electric field detection method and apparatus" (California Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,663,456, issued on June 23, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "In-situ electric field detection method and apparatu... Read More


US Patent Issued to Rockwell Automation Technologies on June 23 for "Fault-managed power via black-channel safety protocol" (Wisconsin Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,663,457, issued on June 23, was assigned to Rockwell Automation Technologies Inc. (Mayfield Heights, Ohio). "Fault-managed power via black-chan... Read More


US Patent Issued to AMCAD ENGINEERING on June 23 for "Method for characterizing in pulse mode a III-V semiconductor transistor and associated test bench" (French Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,663,458, issued on June 23, was assigned to AMCAD ENGINEERING (Limoges, France). "Method for characterizing in pulse mode a III-V semiconductor... Read More


US Patent Issued to Infineon Technologies on June 23 for "Test signal circuit for testing a radio frequency receiver circuit, a semiconductor chip and a system comprising the test signal circuit" (Austrian, German Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,663,459, issued on June 23, was assigned to Infineon Technologies AG (Neubiberg, Germany). "Test signal circuit for testing a radio frequency r... Read More


US Patent Issued on June 23 for "Apparatus for testing electronic devices" (South Korean Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,663,460, issued on June 23. "Apparatus for testing electronic devices" was invented by SeungHyeon Jeong (Chuncheon, South Korea), HunTaek Lee (... Read More


US Patent Issued to Taiwan Semiconductor Manufacturing on June 23 for "System for thermal testing a wafer chuck and methods for performing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,663,461, issued on June 23, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "System for thermal testing a wafer ... Read More


US Patent Issued to NXP USA on June 23 for "On-chip fault detection due to malfunctions on chip pins" (American, Indian Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,663,462, issued on June 23, was assigned to NXP USA Inc. (Austin, Texas). "On-chip fault detection due to malfunctions on chip pins" was invent... Read More


US Patent Issued to Tektronix on June 23 for "Split-path multiplexing accessory for a test and measurement instrument" (Oregon Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,663,463, issued on June 23, was assigned to Tektronix Inc. (Beaverton, Ore.). "Split-path multiplexing accessory for a test and measurement ins... Read More


US Patent Issued to Rohm on June 23 for "Semiconductor integrated circuit device and vehicle" (Japanese Inventor)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,663,464, issued on June 23, was assigned to Rohm Co. Ltd. (Kyoto, Japan). "Semiconductor integrated circuit device and vehicle" was invented by... Read More


US Patent Issued to Tektronix on June 23 for "Test and measurement instrument accessory with reconfigurable processing component" (Oregon Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,663,465, issued on June 23, was assigned to Tektronix Inc. (Beaverton, Ore.). "Test and measurement instrument accessory with reconfigurable pr... Read More